In the process of laser cutting and marking, there are often situations where the marking effect is not ideal, such as uneven pits or light marks. This article will explore in detail how to avoid these problems through parameter settings and provide a set of conventional marking parameters for reference.

1、 Marking parameter settings
1. Select marking process: Draw graphics and automatically generate marking layers, and set marking process as needed.

2. Power and duty cycle: generally set between 15 and 20, and frequency set around 1000 to 2000.

3. Marking gas and pressure: Use the same gas as cutting, with a pressure set between 1-2.

2、 Common problems and solutions
1. The depth of the target varies:

① Reason: The dwell time has not been reset to zero. There is no need to set a dwell time during the marking process, otherwise obvious marks will be left at the beginning.

② Solution: Reset the dwell time and set the power curve. Manually drag the curve node to reduce power when the speed is slow and increase power when the speed is fast

2. Insufficient depth of traces:

① Solution: Increase the air pressure appropriately, or increase the power and duty cycle. Set the focus between -5 and -10 to make the energy more concentrated.

3. Adjustment of trace width:

① Increase width: Set the focus between 5 and 15 and raise the cutting head height to spread energy and widen the trace.

② Trace too faint: Without modifying the focal position, increase the air pressure appropriately to between 1.5 and 2, or increase the power and duty cycle based on the marking results.

3、 Application extension: Evaporative film removal
In order to improve cutting quality, it is sometimes necessary to perform rust removal and film removal operations. You can select the option for evaporative film removal and use the same setting method as the parameter for widening the trace. This approach can effectively remove rust and improve cutting quality.